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Market news from company filings
Stories on important NSE and BSE disclosures: what was filed, how big it is for the company, and how the stock reacted to similar filings before.
- Bonus issueMOLDTKPAC
Mold-Tek Packaging: Record date for the purpose of Bonus is 09-Oct-2026
Mold-Tek Packaging (MOLDTKPAC) filed a disclosure titled "Record date for the purpose of Bonus is 09-Oct-2026". The company is valued at about ₹2,226 crore.
- Bonus issueMOLDTECH
Mold-Tek Technologies announces 1:1 bonus issue
Mold-Tek Technologies (MOLDTECH) said it will issue bonus shares in the ratio 1:1. The company is valued at about ₹576 crore.
Automatically written from the exchange filing and BCEIE data. Not investment advice. Check the original filing before acting on it.